1099 empleos en Tijuana, Baja California

DevOps & CI Infrastructure Software Engineer

North American Production Sharing de México, S.A. de C.V.

Minimum Qualifications 2+ years of experience in software engineering and release engineering/devops Expertise with Python and in scripting languages (Bash) Experience in software build/release/deployment. Experience with Source Control Management (GIT) and CI/CD systems (Jenkins, Gitlab CI, GitHub actions, TeamCity or similar) Experience with Linux or Unix based OS systems software development environment Effective English communication skills (verbal, presentation, written) Previous experience working in an Agile environment, and collaborating with multi-disciplinary teams Programming/debugging skills in more than one programming languages (C/C++ preferred) Some experience working with deep learning models training / inference pipelines. Experience profiling software and optimization techniques. Experience with Windows software development environment. Experience with Software Builds and CI on Windows platforms Experience with Android or other embedded systems and developing tools for embedded platforms. Experience working with virtualization techniques and containerization technologies such as Docker Experience with automated generation and maintenance of complex software documentation. Ability to collaborate across a globally diverse team and multiple interests Education Requirements Required: Bachelor's degree in engineering or equivalent experience required, Information Systems, Computer Science, or related field. Preferred: Master's degree in computer science, Computer Engineering, or Electrical Engineering

Enero 19 2026 en Tijuana

Ingeniero de Calidad Proveedores

North American Production Sharing de México, S.A. de C.V.

Requisitos: Educación: Ingeniería Industrial o afín, Auditor Interno QMS. Experiencia: 3-5 años en calidad de proveedores y manufactura. Conocimientos: Normas ISO 9001 u otras afín. Interpretación de planos y especificaciones técnicas. Normas: ISO 9001, o afín, Core Tools (APQP, PPAP, FMEA, MSA, SPC), VDA 6.3 (deseable). Herramientas de calidad: 8D, 5 Why’s, Ishikawa, control estadístico (Cp/Cpk, GR&R), Validaciones de proceso. Metrología: Calibración, interpretación de GD&T (Deseable), planos e instrucciones de trabajo. Uso de equipos de medición de sistema de visión y básicos. Datos: Excel intermedio, Minitab (o equivalente) para SPC/MSA; Power BI (deseable). Sistemas: SAP (deseable), Office. Habilidades: Manejo de inglés (avanzado). 1. Comunicación efectiva: Capacidad para explicar requisitos de calidad y estándares de manera clara. Escucha activa para entender problemas del proveedor y del equipo interno. 2. Negociación: Habilidad para llegar a acuerdos sobre acciones correctivas, plazos y costos sin comprometer la calidad. 3. Resolución de conflictos: Manejo de desacuerdos con proveedores de forma profesional y orientada a soluciones. 4. Pensamiento crítico: Analizar datos y situaciones para tomar decisiones objetivas y basadas en evidencia. 5. Trabajo en equipo: Colaboración con áreas como ingeniería, compras y producción para asegurar la calidad. 6. Adaptabilidad: Capacidad para ajustarse a cambios en normativas, procesos o prioridades del negocio. 7. Liderazgo: Influencia positiva sobre proveedores para implementar mejoras y cumplir estándares. 8. Gestión del tiempo: Priorización de tareas críticas, especialmente en auditorías y resolución de problemas que puedan impactar el área operativa sin comprometer la calidad del producto.

Enero 19 2026 en Tijuana

ASIC DRAM Bus and PDN Designer

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5 and 3D Chip partition and dependencies on Product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Education: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana